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Adhesive Films

A wide range of adhesive films for a variety of bonding applications, including honeycomb core materials.

Excellent adhesive properties over a wide range of core to skin requirements. Curing temperatures from as low as 50°C and Service temperatures as high as 220°C.

Product
Description
Data Sheet
EF72
EF72 adhesive film is high strength epoxy adhesive formulation supplied in the form of a light weight flexible film. It is intended for metal to metal or sandwich core to skin bonds. Developed alongside Amber Composites range of E700 series component prepregs. A lightweight polyester net is incorporated into the adhesive film to ensure easy handling whilst cutting and positioning.
EF44
EF44 is a high strength low temperature cure epoxy adhesive formulation supplied in the form of a thin film for general adhesive applications. Developed alongside the Amber composites range of E600 series.
REDUX 308-NA
Redux 308-NA is a high strength, flow controlled film adhesive with flexible cure schedules at 150°C or 170°C. Redux 308-NA contains glass beads which gives good flow control. It is suitable for metal to metal and structural sandwich bonding applications, where operating temperatures of up to 125°C may be experienced.
REDUX 312
Redux 312 is a high strength 120°C curing film adhesive, suitable for metal to metal bonding and sandwich constructions, where operating temperature of up to 100°C may be experienced. A supported version, Redux 312/5, is available with a woven nylon carrier for bond line thickness control.
REDUX 319
The Redux 319 series consists of film adhesives curing at 175°C. They are available in both supported and unsupported versions at areal weights between 180 and 400g/m. The supported versions contain a woven nylon carrier for peel enhancements and glue-line thickness control.
REDUX 322
Redux 322 is a high performance modified epoxy film adhesive curing at 175°C.
It is suitable for bonding metal to metal and for sandwich structures, where operating temperatures are experienced up to 220°C for shot periods, or 200°C for continuous operation. Redux 322 is a hot melt film which is free form solvents and consequently has a very low volatile content.
REDUX 609
Redux 609 is curing modified epoxy film adhesive containing cotton scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 300g/m2 and 200g/m2 and is also available unsupported at 282gsm.
AX001
AX001 is a high performance adhesive film curing at a temperature of 135°C.
Used for the bonding of laminated and veneers to a variety of substrates including aluminium. The adhesive is carried on a synthetic fleece to give high tear resistance.
Amber Composites offer these products as part of their Composite Materials range.
Please see our Composite Technology brochure for more information.